For both papers, there will be two journal papers to be submitted to a special edition of JJAP by mid-October.There were excellent talks from companies like Intel and universities on quantum computers. Some networking was established with Japanese companies/universities. A…
The EU project MATQu (Materials for Quantum Computing) successfully completed the second project year in May. During this time, the project partners have jointly achieved the first results and submitted the project’s deliverables and milestones. For this purpose, the second…
This paper presents morphological, mechanical and low temperature electrical characterizations of test vehicles comprising evaporated indium microbumps.
https://sqa-conference.org/SQA-Conference-Guide.pdf
A journal paper was submitted to Microelectronic Engineering on developing new cleaning chemistry for resist and fluoropolymer cleaning deposited during the DRIE Bosch process for quantum computing. This chemistry is effective in cleaning the high aspect ratio TSVs verified with…
A conference related journal paper was submitted to ECTC 2023 on electroplating of indium on superconducting layers, the growth rate of IMC between indium and SC layers (Nb/In and TiN/In), impact of atmospheric plasma cleaning on surface characteristics of indium…
The project meeting in the EU project “MATQu” took place for the first time in presence. The second General Assembly of the EU project “MATQu” (Materials for Quantum Computing) took place on November 22 at Fraunhofer IPMS in Dresden, Germany….
In the frame of the MATQu project, a state-of-the-art interposer is designed with high aspect ratio through-silicon vias (TSV) that aim at interconnecting qubits with a readout wafer in a 3D multi-stacking manner. High quality TSV require an efficient surface…