Conference paper was submitted at ECTC 2023 by CEA-LETI
This paper presents morphological, mechanical and low temperature electrical characterizations of test vehicles comprising evaporated indium microbumps.
Project News
SQA conference 2022: imec presents MATQu related topics
https://sqa-conference.org/SQA-Conference-Guide.pdf
Journal paper submitted to Microelectronic Engineering
A journal paper was submitted to Microelectronic Engineering on developing new cleaning chemistry for resist and fluoropolymer cleaning deposited during the DRIE Bosch process for quantum computing. This chemistry is effective in cleaning the high aspect ratio TSVs verified with…
Journal paper submitted to ECTC 2023
A conference related journal paper was submitted to ECTC 2023 on electroplating of indium on superconducting layers, the growth rate of IMC between indium and SC layers (Nb/In and TiN/In), impact of atmospheric plasma cleaning on surface characteristics of indium…
Second General Assembly in the EU-funded project “MATQu”
The project meeting in the EU project “MATQu” took place for the first time in presence. The second General Assembly of the EU project “MATQu” (Materials for Quantum Computing) took place on November 22 at Fraunhofer IPMS in Dresden, Germany….
MATQu @ SPCC conference 2022: Through Silicon Vias cleaning for quantum computer interconnects integration
In the frame of the MATQu project, a state-of-the-art interposer is designed with high aspect ratio through-silicon vias (TSV) that aim at interconnecting qubits with a readout wafer in a 3D multi-stacking manner. High quality TSV require an efficient surface…
First General Assembly
To highlight the project’s first year and present the first project results for the whole consortium, a general assembly in the project “Materials for Quantum Computing (MATQu)” will take place virtually on March 23rd, 2022.
Kick-off
The kick-off meeting took place as a virtual event on June 17th, 2021. It was a three-hour event with 62 participants from all 18 project partners.