Project Results

The MATQu project follows a standard work package structure consisting of five technical work packages (WP1 – WP5) enclosed by two non-technical work packages (WP6 and WP7) as can be seen below.

Work packages
  • WP 1 – Specific High Resistivity and Low defectivity substrates
  • WP 2 – Materials, modules, and processes for superconducting qbits  
  • WP 3 – 3D packaging and bonding 
  • WP 4 – Characterization tools and Benchmarking
  • WP 5 – Simulation and Characterization Demonstrators
  • WP 6 – Dissemination and Communication      
  • WP 7 – Management          

Images and videos of the project‘s results

Microscopy image sequence of a representative photoresist-stripping process by aqueous, NMP-free, and sustainable fluids

The sequence shows microscopy images (100x & 200x magnification) of a representative photoresist-stripping experiment. The attacking and lift-off behavior of different resists from various semiconductor substrates (e.g., Si-wafers) were studied in detail.


Video of a representative photoresist-stripping process by aqueous, NMP-free, and sustainable fluids

The video demonstrates a representative photoresist-stripping experiment. The lift-off behavior of different resists were studied in detail. The formulations were optimized towards the fastest possible times to completely remove specific layers from various substrates.

© intelligent fluids

Deliverables
Achieved Milestones