Project Results

The MATQu project follows a standard work package structure consisting of five technical work packages (WP1 – WP5) enclosed by two non-technical work packages (WP6 and WP7)

Work packages 1-7
  • WP 1 – Specific High Resistivity & Low defectivity substrates
  • WP 2 – Materials, modules & processes for superconducting qbits
  • WP 3 – 3D packaging & bonding
  • WP 4 – Characterization tools & Benchmarking
  • WP 5 – Simulation & Characterization Demonstrators
  • WP 6 – Dissemination & Communication
  • WP 7 – Management

Deliverables
Achieved Milestones

Images and videos of the project‘s results

Microscopy image sequence of a representative photoresist-stripping process by aqueous, NMP-free, and sustainable fluids

The sequence shows microscopy images (100x & 200x magnification) of a representative photoresist-stripping experiment. The attacking and lift-off behaviour of different resists from various semiconductor substrates (e.g., Si-wafers) were studied in detail.

Video of a representative photoresist-stripping process by aqueous, NMP-free, and sustainable fluids

The video demonstrates a representative photoresist-stripping experiment. The lift-off behaviour of different resists were studied in detail. The formulations were optimized towards the fastest possible times to completely remove specific layers from various substrates.

© intelligent fluids

Three variations of a lab-scale formation of sustainable, complex, water-based phasefluid prototype formulations for coupon level application tests:


Fraunhofer IAF uses advanced cryogenic measurement capacities for quantum computing hardware in the project MATQu

Link to video


This project leading to this application has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 101007322. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Germany, France, Belgium, Austria, Netherlands, Finland, Israel.