The MATQu project follows a standard work package structure consisting of five technical work packages (WP1 – WP5) enclosed by two non-technical work packages (WP6 and WP7)
- WP 1 – Specific High Resistivity & Low defectivity substrates
- WP 2 – Materials, modules & processes for superconducting qbits
- WP 3 – 3D packaging & bonding
- WP 4 – Characterization tools & Benchmarking
- WP 5 – Simulation & Characterization Demonstrators
- WP 6 – Dissemination & Communication
- WP 7 – Management
Images and videos of the project‘s results
Microscopy image sequence of a representative photoresist-stripping process by aqueous, NMP-free, and sustainable fluids
The sequence shows microscopy images (100x & 200x magnification) of a representative photoresist-stripping experiment. The attacking and lift-off behaviour of different resists from various semiconductor substrates (e.g., Si-wafers) were studied in detail.
Video of a representative photoresist-stripping process by aqueous, NMP-free, and sustainable fluids
The video demonstrates a representative photoresist-stripping experiment. The lift-off behaviour of different resists were studied in detail. The formulations were optimized towards the fastest possible times to completely remove specific layers from various substrates.
Three variations of a lab-scale formation of sustainable, complex, water-based phasefluid prototype formulations for coupon level application tests:
This project leading to this application has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 101007322. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Germany, France, Belgium, Austria, Netherlands, Finland, Israel.