A journal paper was submitted to Microelectronic Engineering on developing new cleaning chemistry for resist and fluoropolymer cleaning deposited during the DRIE Bosch process for quantum computing. This chemistry is effective in cleaning the high aspect ratio TSVs verified with TofSIMS analysis and SEM inspection.
This project leading to this application has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 101007322. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Germany, France, Belgium, Austria, Netherlands, Finland, Israel.