A conference related journal paper was submitted to ECTC 2023 on electroplating of indium on superconducting layers, the growth rate of IMC between indium and SC layers (Nb/In and TiN/In), impact of atmospheric plasma cleaning on surface characteristics of indium bumps and developing TCB die to wafer bonding process for indium to indium and indium to SC pads bonding.
This project leading to this application has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 101007322. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Germany, France, Belgium, Austria, Netherlands, Finland, Israel.