Journal paper submitted to ECTC 2023

A conference related journal paper was submitted to ECTC 2023 on electroplating of indium on superconducting layers, the growth rate of IMC between indium and SC layers (Nb/In and TiN/In), impact of atmospheric plasma cleaning on surface characteristics of indium bumps and developing TCB die to wafer bonding process for indium to indium and indium to SC pads bonding.