MATQu

Materials for Quantum Computing
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Conference paper was submitted at ECTC 2023 by CEA-LETI

Posted in Project News Published on 03/20/2023 Authors Christina

This paper presents morphological, mechanical and low temperature electrical characterizations of test vehicles comprising evaporated indium microbumps.

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imec publishes MATQu related papers

Posted in Project News Published on 03/07/2023 Authors Christina
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APS march meeting 2023: imec presents MATQu related topics

Posted in Project News Published on 03/07/2023 Authors Christina
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SQA conference 2022: imec presents MATQu related topics

Posted in Project News Published on 03/07/2023 Authors Christina

https://sqa-conference.org/SQA-Conference-Guide.pdf

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Journal paper submitted to Microelectronic Engineering

Posted in Project News Published on 02/23/2023 Authors Christina

A journal paper was submitted to Microelectronic Engineering on developing new cleaning chemistry for resist and fluoropolymer cleaning deposited during the DRIE Bosch process for quantum computing. This chemistry is effective in cleaning the high aspect ratio TSVs verified with…

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Journal paper submitted to ECTC 2023

Posted in Project News Published on 02/20/2023 Authors Christina

A conference related journal paper was submitted to ECTC 2023 on electroplating of indium on superconducting layers, the growth rate of IMC between indium and SC layers (Nb/In and TiN/In), impact of atmospheric plasma cleaning on surface characteristics of indium…

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Second General Assembly in the EU-funded project “MATQu”

Posted in Press Releases, Project News Published on 11/22/2022 Authors Tina

The project meeting in the EU project “MATQu” took place for the first time in presence. The second General Assembly of the EU project “MATQu” (Materials for Quantum Computing) took place on November 22 at Fraunhofer IPMS in Dresden, Germany….

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SQA Conference

Posted in Community News Published on 11/18/2022 Authors Christina

The Superconducting Qubits and Algorithms (SQA) Conference took place in August 2022 in Helsinki, Finland.

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MATQu @ SPCC conference 2022: Through Silicon Vias cleaning for quantum computer interconnects integration

Posted in Project News Published on 08/29/2022 Authors Tina

In the frame of the MATQu project, a state-of-the-art interposer is designed with high aspect ratio through-silicon vias (TSV) that aim at interconnecting qubits with a readout wafer in a 3D multi-stacking manner. High quality TSV require an efficient surface…

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First General Assembly

Posted in Project News Published on 03/23/2022 Authors Tina

To highlight the project’s first year and present the first project results for the whole consortium, a general assembly in the project “Materials for Quantum Computing (MATQu)” will take place virtually on March 23rd, 2022.

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